RJR Polymers announces CTO appointment for packaging division

Omnexus - Dec 6, 2002

OAKLAND, CA, Dec. 6 -- RJR Polymers has announced the appointment of John Roman to the position of chief technical officer for the company's R-Pak(TM) packaging division. Roman has over 25 years of experience in design and production of wireless and microwave electronics. His background includes management of all aspects of electronic packaging technology, including materials, substrate technologies, die attach, wire bonding, interconnections, sealing, assembly techniques, module design and system integration. Roman comes to RJR from his recent appointment as director of RF Product Development with SatCon Electronics, a Boston-based electronics manufacturer. He worked for 17 years as a principal...

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